礦ision Build Log
Project:
E:\资料\段哥资料\1.54低温电子纸\GDEM0154E97LT程序示例\USER\mdk.uvproj
Project File Date:  09/21/2017

Output:
Build target 'GDE'
linking...
Program Size: Code=5024 RO-data=6120 RW-data=56 ZI-data=1832  
FromELF: creating hex file...
".\Debug\obj\mdk.axf" - 0 Error(s), 0 Warning(s).
Load "E:\\资料\\段哥资料\\1.54低温电子纸\\GDEM0154E97LT程序示例\\USER\\Debug\\obj\\mdk.axf" 
Set JLink Project File to "E:\资料\段哥资料\1.54低温电子纸\GDEM0154E97LT程序示例\USER\JLinkSettings.ini"
* JLink Info: Device "STM32F103VB" selected (128 KB flash, 20 KB RAM).
 
JLink info:
------------
DLL: V4.76d, compiled Sep 13 2013 16:35:06
Firmware: J-Link V9 compiled Jan 21 2016 18:49:33
Hardware: V9.20
Feature(s) : GDB, RDI, FlashBP, FlashDL, JFlash 
 
* JLink Info: TotalIRLen = 9, IRPrint = 0x0011
* JLink Info: TotalIRLen = 9, IRPrint = 0x0011
* JLink Info: Found Cortex-M3 r1p1, Little endian.
* JLink Info: FPUnit: 6 code (BP) slots and 2 literal slots
* JLink Info: TPIU fitted.
ROMTableAddr = 0xE00FF003
* JLink Info: Found Cortex-M3 r1p1, Little endian.
 
Target info:
------------
Device: STM32F103VB
VTarget = 3.227V
State of Pins: 
TCK: 1, TDI: 0, TDO: 0, TMS: 0, TRES: 1, TRST: 1
Hardware-Breakpoints: 0
Software-Breakpoints: 8192
Watchpoints:          0
JTAG speed: 10000 kHz
 
Erase Done.
Programming Done.
Verify OK.
* JLink Info: Found Cortex-M3 r1p1, Little endian.
Application running ...