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    礦ision Build Log
    Project:
    F:\佳显电子\新程序\电子纸驱动程序更新20191008\HLT\1.54\GDEH0154D67_P-20190920\Project\mdk.uvproj
    Project File Date:  10/17/2018

    Output:
    Build target 'GDE'
    compiling EPAPER.c...
    linking...
    Program Size: Code=6570 RO-data=19722 RW-data=24 ZI-data=1632
    FromELF: creating hex file...
    ".\Debug\obj\mdk.axf" - 0 Error(s), 0 Warning(s).

"F:\\佳显电子\\新程序\\电子纸驱动程序更新20191008\\HLT\\1.54\\GDEH0154D67_P-20190920\\Project\\Debug\\obj\\mdk.axf" Set JLink Project File to "F:\佳显电子\新程序\电子纸驱动程序更新20191008\HLT\1.54\GDEH0154D67_P-20190920\Project\JLinkSettings.ini" * JLink Info: Device "STM32F103C8" selected (64 KB flash, 20 KB RAM). JLink info: ------------ DLL: V4.76d, compiled Sep 13 2013 16:35:06 Firmware: J-Link ARM-OB STM32 compiled Aug 22 2012 19:52:04 Hardware: V7.00 S/N : 20090928 Feature(s) : RDI,FlashDL,FlashBP,JFlash,GDBFull * JLink Info: Found SWD-DP with ID 0x1BA01477 * JLink Info: Found SWD-DP with ID 0x1BA01477 * JLink Info: Found Cortex-M3 r1p1, Little endian. * JLink Info: FPUnit: 6 code (BP) slots and 2 literal slots * JLink Info: TPIU fitted. * JLink Info: ETM fitted. ROMTableAddr = 0xE00FF003 Target info: ------------ Device: STM32F103C8 VTarget = 3.300V State of Pins: TCK: 0, TDI: 0, TDO: 1, TMS: 0, TRES: 1, TRST: 1 Hardware-Breakpoints: 6 Software-Breakpoints: 8192 Watchpoints: 4 JTAG speed: 4000 kHz Erase Done. Programming Done. Verify OK. Application running ...