礦ision Build Log
Project:
F:\佳显电子\新产品开发\新产品开发--合力泰电子纸\常规品\GDEH029D57LT_SSD1675B-20200114\Project\mdk.uvproj
Project File Date:  10/17/2018

Output:
Build target 'GDE'
compiling main.c...
linking...
Program Size: Code=4578 RO-data=5074 RW-data=24 ZI-data=1632  
FromELF: creating hex file...
".\Debug\obj\mdk.axf" - 0 Error(s), 0 Warning(s).

SSD1675B-20200114\Project\JLinkSettings.ini" * JLink Info: Device "STM32F103C8" selected (64 KB flash, 20 KB RAM). JLink info: ------------ DLL: V4.76d, compiled Sep 13 2013 16:35:06 Firmware: J-Link ARM-OB STM32 compiled Aug 22 2012 19:52:04 Hardware: V7.00 S/N : 20090928 Feature(s) : RDI,FlashDL,FlashBP,JFlash,GDBFull * JLink Info: Found SWD-DP with ID 0x1BA01477 * JLink Info: Found SWD-DP with ID 0x1BA01477 * JLink Info: Found Cortex-M3 r1p1, Little endian. * JLink Info: FPUnit: 6 code (BP) slots and 2 literal slots * JLink Info: TPIU fitted. * JLink Info: ETM fitted. ROMTableAddr = 0xE00FF003 Target info: ------------ Device: STM32F103C8 VTarget = 3.300V State of Pins: TCK: 0, TDI: 0, TDO: 1, TMS: 0, TRES: 1, TRST: 1 Hardware-Breakpoints: 6 Software-Breakpoints: 8192 Watchpoints: 4 JTAG speed: 4000 kHz Erase Done. Programming Done. Verify OK. Application running ...