礦ision Build Log
Project:
F:\佳显电子\新产品开发\新产品开发—电子纸\2.6寸单色\4灰阶\GDEW026T0_4Gray_P-20190911\Project\mdk.uvproj
Project File Date:  07/31/2019

Output:
Build target 'mdk'
compiling main.c...
linking...
Program Size: Code=6362 RO-data=64282 RW-data=24 ZI-data=1632  
FromELF: creating hex file...
".\Debug\obj\mdk.axf" - 0 Error(s), 0 Warning(s).
Load "F:\\佳显电子\\新产品开发\\新产品开发—电子纸\\2.6寸单色\\4灰阶\\GDEW026T0_4Gray_P-20190911\\Project\\Debug\\obj\\mdk.axf" 
Set JLink Project File to "F:\佳显电子\新产品开发\新产品开发—电子纸\2.6寸单色\4灰阶\GDEW026T0_4Gray_P-20190911\Project\JLinkSettings.ini"
* JLink Info: Device "STM32F103VE" selected (512 KB flash, 64 KB RAM).
 
JLink info:
------------
DLL: V4.76d, compiled Sep 13 2013 16:35:06
Firmware: J-Link ARM-OB STM32 compiled Aug 22 2012 19:52:04
Hardware: V7.00
S/N : 20090928 
Feature(s) : RDI,FlashDL,FlashBP,JFlash,GDBFull 
 
* JLink Info: Found SWD-DP with ID 0x1BA01477
* JLink Info: Found SWD-DP with ID 0x1BA01477
* JLink Info: Found Cortex-M3 r1p1, Little endian.
* JLink Info: FPUnit: 6 code (BP) slots and 2 literal slots
* JLink Info: TPIU fitted.
* JLink Info: ETM fitted.
ROMTableAddr = 0xE00FF003
 
Target info:
------------
Device: STM32F103VE
VTarget = 3.300V
State of Pins: 
TCK: 0, TDI: 0, TDO: 1, TMS: 0, TRES: 1, TRST: 1
Hardware-Breakpoints: 6
Software-Breakpoints: 8192
Watchpoints:          4
JTAG speed: 4000 kHz
 
Erase Done.
Programming Done.
Verify OK.
Application running ...